3D Chips Smash AI Speed Barriers

Stanford researchers built the first monolithic 3D chip in a U.S. foundry. The prototype delivers order-of-magnitude AI performance improvements. Key Points: • Vertical architecture achieves 4× current performance, simulations show 12× potential gains • Monolithic fabrication enables record-dense vertical connections between memory and computing units • Domestic production at SkyWater Technology advances U.S. semiconductor manufacturing independence